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RFHIC will launch DiaFlux™, a family of thermal-grade polycrystalline CVD diamond heat spreaders developed for high-power RF, microwave, optoelectronic, and semiconductor packaging applications. Full product specifications and product pages will go live on Tuesday, September 8, 2026.
For two decades, RFHIC has designed and manufactured GaN RF and microwave devices — components whose performance depends on how quickly heat leaves a millimeter-scale die. As power densities continue to rise across telecom, radar, RF energy, laser, and advanced packaging applications, the thermal performance of the first layer beneath the device increasingly determines the thermal budget of the entire system. DiaFlux™ applies RFHIC's device-level thermal understanding to the material itself.
The DiaFlux™ family will launch with two grades:
Both grades are grown by plasma-assisted chemical vapor deposition, are electrically insulated, and will be offered in engineered geometries spanning chips, plates, heat spreaders, and wafers — including custom formats. Complete dimensional specifications, tolerances, and surface-finish data will be published at launch.
If interested in learning more about RFHIC’s DiaFlux™ technology, please contact us at www.rfhic.com/contact
About RFHIC
RFHIC (KOSDAQ: A218410) is a global leader in GaN RF and microwave solutions, specializing in wireless communications, defense, aerospace, and industrial RF energy applications. The company develops and manufactures high-power GaN transistors, MMICs, solid-state power amplifiers, and microwave generator systems, all produced in-house for superior quality and performance. RFHIC is committed to advancing next-generation power semiconductor technologies to create a more connected, energy-efficient, and innovative future. Learn more at www.rfhic.com.
RFHIC® is a registered trademark.