Wireless Infrastructure
RFHIC today launched DiaFlux™, a family of thermal-grade polycrystalline CVD diamond heat spreaders for high-power RF, microwave, optoelectronic, and semiconductor packaging applications. The DiaFlux™ product pages, including full specifications for both grades, are now live on RFHIC’s website. [https://rfhic.com/products-diamond-materials/]
Modern high-power designs concentrate ever-greater heat flux beneath small, high-power die. When conventional heat-spreader materials become the bottleneck, the design's thermal ceiling caps output power, density, and performance. DiaFlux™ brings the highest-thermal-conductivity material class in engineering practice directly to the point of heat generation — in the sizes, thicknesses, and tolerances real packages need.
The family launches with two grades sharing one form-factor system:

Key specifications (both grades):

Because both grades share identical form factors, thickness, tolerances, and surface finish, grade selection is purely a thermal-performance decision — switching grades does not change the mechanical design.
Getting started
Engineers evaluating a thermal design can request a technical consultation with RFHIC's application engineering team through the DiaFlux™ product pages. To learn more, please contact us.
About RFHIC
RFHIC (KOSDAQ: A218410) is a global leader in GaN RF and microwave solutions, specializing in wireless communications, defense, aerospace, and industrial RF energy applications. The company develops and manufactures high-power GaN transistors, MMICs, solid-state power amplifiers, and microwave generator systems, all produced in-house for superior quality and performance. RFHIC is committed to advancing next-generation power semiconductor technologies to create a more connected, energy-efficient, and innovative future. Learn more at www.rfhic.com.
RFHIC® is a registered trademark.
For more information, please contact:
RFHIC Corporation — Global Sales & Marketing — Email: marketing@rfhic.com