RFHIC’s polycrystalline CVD diamond heat spreaders deliver high thermal conductivity with electrically insulating properties for AI semiconductor, GaN RF, SiC power module, and laser diode thermal management. Customized solutions are available upon request.
| Part Number | Datasheet | Size | Edges | Edge Features | Lateral Tolerance | Form | Growth Method | Structure | Thermal Conductivity | Thickness | Surface Roughness (Ra) | Electrical Property | Grade |
| DiaFlux™ 150 | Ø3–100 mm (round) / 3×3–70×70 mm (square) | Laser cut | <0.2 mm | ±0.2 mm | Custom Plate, Chip, Heat Spreader, Wafer | Plasma Chemical Vapor Deposition | Cubic, Polycrystalline | 1,500 W/m·K (at 25 °C) | 200 / 350 / 500 µm (±20 µm) | <20 nm | Electrically Insulating | Standard Thermal Grade | |
| DiaFlux™ 180 | Ø3–100 mm (round) / 3×3–70×70 mm (square) | Laser cut | <0.2 mm | ±0.2 mm | Custom Plate, Chip, Heat Spreader, Wafer | Plasma Chemical Vapor Deposition | Cubic, Polycrystalline | 1,800 W/m·K (at 25 °C) | 200 / 350 / 500 µm (±20 µm) | <20 nm | Electrically Insulating | High Performance Thermal Grade |