News
2026-09-07

[News] RFHIC Launches DiaFlux™ Thermal-Grade CVD Diamond Heat Spreaders in Two Grades

RFHIC today launched DiaFlux™, a family of thermal-grade polycrystalline CVD diamond heat spreaders for high-power RF, microwave, optoelectronic, and semiconductor packaging applications. The DiaFlux™ product pages, including full specifications for both grades, are now live on RFHIC’s website. [https://rfhic.com/products-diamond-materials/]

Modern high-power designs concentrate ever-greater heat flux beneath small, high-power die. When conventional heat-spreader materials become the bottleneck, the design's thermal ceiling caps output power, density, and performance. DiaFlux™ brings the highest-thermal-conductivity material class in engineering practice directly to the point of heat generation — in the sizes, thicknesses, and tolerances real packages need.

The family launches with two grades sharing one form-factor system:

  • DiaFlux™ 150 — Standard Thermal Grade: 1,500 W/m·K at 25 °C, for the broad range of high-power applications where conventional spreaders limit the design
  • DiaFlux™ 180 — High Performance Thermal Grade: 1,800 W/m·K at 25 °C, for the most thermally demanding designs

RFHIC DiaFlux 150 and DiaFlux 180 thermal-grade CVD diamond heat spreaders on a 4-inch polycrystalline diamond wafer

Key specifications (both grades):

  • Polycrystalline CVD diamond, grown by plasma-assisted chemical vapor deposition; electrically insulating
  • Thicknesses: 200, 350, and 500 µm, held to ±20 µm
  • Round formats Ø3–100 mm; square formats 3 × 3 mm to 70 × 70 mm; custom geometries available
  • Laser-cut edges with feature sizes below 0.2 mm; lateral tolerance ±0.2 mm
  • Surface roughness Ra <20 nm
  • Supplied as plates, chips, heat spreaders, and wafers

Because both grades share identical form factors, thickness, tolerances, and surface finish, grade selection is purely a thermal-performance decision — switching grades does not change the mechanical design.

Getting started

Engineers evaluating a thermal design can request a technical consultation with RFHIC's application engineering team through the DiaFlux™ product pages. To learn more, please contact us.

www.rfhic.com/contact


About RFHIC

RFHIC (KOSDAQ: A218410) is a global leader in GaN RF and microwave solutions, specializing in wireless communications, defense, aerospace, and industrial RF energy applications. The company develops and manufactures high-power GaN transistors, MMICs, solid-state power amplifiers, and microwave generator systems, all produced in-house for superior quality and performance. RFHIC is committed to advancing next-generation power semiconductor technologies to create a more connected, energy-efficient, and innovative future. Learn more at www.rfhic.com.

RFHIC® is a registered trademark.

For more information, please contact:

RFHIC Corporation — Global Sales & Marketing — Email: marketing@rfhic.com