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DiaFlux™ 180

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Description

RFHIC’s DiaFlux™ 180 is a polycrystalline CVD diamond heat spreader grown by plasma chemical vapor deposition. It provides a high thermal conductivity of 1,800 W/m·K (at 25 °C) along with electrically insulating properties, and is available in 200 / 350 / 500 µm thicknesses with custom sizes and forms. The DiaFlux 180 is suitable for thermal management of a wide range of high-power devices, including AI accelerators, high-power GaN HEMTs, RF and microwave devices, SiC power electronics, and laser diodes.

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AI Accelerator and High-Power Chip Cooling
High-Power GaN HEMT Thermal Management
RF and Microwave Device Heat Spreader
SiC Power Electronics Cooling
High-Power Laser Diode Submount
Advanced Semiconductor Packaging
Aerospace, Defense, and Scientific Thermal Applications

Specification

Size Ø3–100 mm (round) / 3×3–70×70 mm (square)
Edges Laser cut
Edge Features <0.2 mm
Lateral Tolerance ±0.2 mm
Form Custom Plate, Chip, Heat Spreader, Wafer
Growth Method Plasma Chemical Vapor Deposition
Structure Cubic, Polycrystalline
Thermal Conductivity 1,800 W/m·K (at 25 °C)
Thickness 200 / 350 / 500 µm (±20 µm)
Surface Roughness (Ra) <20 nm
Electrical Property Electrically Insulating
Grade High Performance Thermal Grade