RFHIC’s CVD diamond materials provide ultra-high thermal conductivity heat spreaders for high-power electronics, RF, optoelectronics, and advanced thermal management applications. Customized sizes and forms are available upon request.
| Part Number | Datasheet | Size | Edges | Edge Features | Lateral Tolerance | Form | Growth Method | Structure | Thermal Conductivity | Thickness | Surface Roughness (Ra) | Electrical Property | Grade |
| DiaFlux™ 150 | Ø3–100 mm (round) / 3×3–70×70 mm (square) | Laser cut | <0.2 mm | ±0.2 mm | Custom Plate, Chip, Heat Spreader, Wafer | Plasma Chemical Vapor Deposition | Cubic, Polycrystalline | 1,500 W/m·K (at 25 °C) | 200 / 350 / 500 µm (±20 µm) | <20 nm | Electrically Insulating | Standard Thermal Grade | |
| DiaFlux™ 180 | Ø3–100 mm (round) / 3×3–70×70 mm (square) | Laser cut | <0.2 mm | ±0.2 mm | Custom Plate, Chip, Heat Spreader, Wafer | Plasma Chemical Vapor Deposition | Cubic, Polycrystalline | 1,800 W/m·K (at 25 °C) | 200 / 350 / 500 µm (±20 µm) | <20 nm | Electrically Insulating | High Performance Thermal Grade |