Home Products Diamond Materials Diamond Wafer DiaFlux™ 150

DiaFlux™ 150

Diamond Wafer
Production
Contact
Sales

Description

RFHIC’s DiaFlux™ 150 is a polycrystalline CVD diamond heat spreader grown by plasma chemical vapor deposition. It provides a thermal conductivity of 1,500 W/m·K (at 25 °C) along with electrically insulating properties, and is available in 200 / 350 / 500 µm thicknesses with custom sizes and forms. The DiaFlux 150 is suitable for thermal management of a wide range of high-power devices, including AI semiconductors, GaN RF devices, SiC power modules, laser diodes, and RF power devices.

View Product Specification
AI Semiconductor Thermal Management
GaN RF Device Heat Spreader
SiC Power Module Cooling
Laser Diode Submount
RF Power Device Thermal Management
Power Electronics Heat Dissipation
Advanced Semiconductor Packaging

Specification

Size Ø3–100 mm (round) / 3×3–70×70 mm (square)
Edges Laser cut
Edge Features <0.2 mm
Lateral Tolerance ±0.2 mm
Form Custom Plate, Chip, Heat Spreader, Wafer
Growth Method Plasma Chemical Vapor Deposition
Structure Cubic, Polycrystalline
Thermal Conductivity 1,500 W/m·K (at 25 °C)
Thickness 200 / 350 / 500 µm (±20 µm)
Surface Roughness (Ra) <20 nm
Electrical Property Electrically Insulating
Grade Standard Thermal Grade